Design Capability

Cantilever, Vertical, Shelf, multidie, Burn-In, RF, Mother Boards, Driver Boards, Memory Modules, Back Planes, Regulator boards, and but not limited to High Current.

Teradyne, Agilent, LTXCredence, Advantest, Nptest, Mosaid, and Custom.


Kes, Aehr, Blue M, Lunaire, Gruenberg.


Our current capacity consists of 6 to 10 designs per month.

Planarization Mother Board. A PCB designed to adapt a probe card to a probe planarizer test system. The planarizer is utilized to verify needle alignment, and planarity. (Planarity
Spider Card

A spider card (also known as a daughter card) is a smaller version of a DIB designed to be mounted on a PIB, rather than directly to the test head. The use of a spider card instead of a full size DIB reduces the cost to the customer (due to its size), and provides the ability to leave a PIB installed on the tester, allowing easy replacement of spider cards for different products. Performance does suffer somewhat as compared to a full size DIB, because of the additional interface (the PIBs tower) that all signals must travel through.

Probe Card

A PCB designed to adapt the pin electronics of the test head (in full size version), or of the pogo tower (from a PIB), to a set of needles aligned to match the bond-out pad pattern of a semiconductor device. Probe cards are used in conjunction with a prober to test individual or multiple integrated circuits prior to separation from the wafer. Probe cards are used for wafer test only.


Cable interface boards can be utilized in a variety of situations. A CIB can be installed directly on the test head and bring all tester functions out to connectors. Cables can then be installed on the connectors and wired to bench top testers, probers, or a variety of other equipment. Conversely, CIBs can be designed for installation on bench top testers, or probers, and wired back to a variety of test equipment. For this reason, a CIB can be used for either wafer or package test.


A PCB designed to adapt the pin electronics of the test head, to a smaller diameter interface (or pogo tower) that can accept probe and spider cards. PIBs typically have a large cutout in the center to facilitate viewing of the wafer during test. The PIB is a dual purpose PCB, and can be utilized for both wafer (using a probe card) and packaged test (using a spider card).


Similar to a DIB, except the DUTs are installed automatically using a handler. The physical appearance of a HIB is the same as a DIB, with the exception of several non-plated through holes surrounding the socket. The additional non-plated through holes are used by course and fine alignment pins on the chuck of the handler. A HIB, like the DIB, is not designed for use in wafer testing.


A PCB designed to adapt the pin electronics within the test head, to a socket (or socket pins) that accept packaged semiconductors. The DIB is mounted directly to the test head, and DUTs are installed in the socket by hand. DIBs are sometimes referred to as


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