Design Capability

Cantilever, Vertical, Shelf, multidie, Burn-In, RF, Mother Boards, Driver Boards, Memory Modules, Back Planes, Regulator boards, and but not limited to High Current.

Teradyne, Agilent, LTXCredence, Advantest, Nptest, Mosaid, and Custom.


Kes, Aehr, Blue M, Lunaire, Gruenberg.


Our current capacity consists of 6 to 10 designs per month.


Semiconductor test equipment is designed to deliver and receive high quality test signals to and from pogo pins, or connectors within the test head. From there, the signals are transferred to a PCB and become the responsibility of the designer to maintain their integrity. Knowledge of the interface between test systems and the PCB is essential in order to maintain a smooth transition from one medium to the other, and to assure the interface board will install properly. This section explores interface connection systems, design criteria, and the various tester resources that must be translated to the PCB, often through additional interfaces.

Design Restrictions

Mechanical interface


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